研发强度、承销商跟投意愿和IPO抑价——基于科创板上市公司的实证研究

研发强度、承销商跟投意愿和IPO抑价——基于科创板上市公司的实证研究

FINANCE AND ECONOMY ›› 2020, Vol. 0 ›› Issue (11) : 73-81.

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FINANCE AND ECONOMY ›› 2020, Vol. 0 ›› Issue (11) : 73-81. DOI: 10.19622/j.cnki.cn36-1005/f.2020.11.009

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